Today on 13th December 2018, MediaTek announced the next-gen Helio P90 chip for the affordable flagship killer smartphones. The system-on-chip (SoC) features advanced AI engine which can deliver AI experience 4x more powerful than its predece Helio P60 and Helio P70 SoC. MediaTek claims that the chipset will provide the ability to OEMs of better camera features, battery life, and performance over AI.
Helio P90 Announced With AI Engine – Overview
Just like the Helio P70, this new chipset also comes with enhanced dedicated AI engine which is expected to be available globally in Q1 of 2019. The MediaTek Helio P90 SoC comes with an octa-core CPUs based on 2 x ARM Cortex-A75 cores clocked up to 2.0 GHz and 6 x ARM Cortex-A55 cores up to 2.0 GHz. These cores are arranged in big.LITTLE architecture process coupled with PowerVR GM 9446 GPU.
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In addition, the MediaTek’s CorePilot technology ensures the RAM Management and power efficiency tasks in a smoother way than its predecessors. The mobile chipset supports 2-channel 1866 MHz LPDDR4x RAM (up to 8GB) and 21:9 Full HD+ (1080 x 2520 pixels) displays.
Helio P90 Features
The new dedicated APU 2.0 Fusion AI architecture allows Helio P90 SoC for faster and complex AI experiences. Such as scene detection, human body movement, face recognition, real-time beautification etc. It also supports commonly used frameworks such as TensorFlow, TF Lite, Caffe, Caffe2 etc. The three image signal processors (ISPs) supports up to 48 MP single camera or (24 MP + 16 MP) dual cameras.
The Helio P90 ISP AI Engine can accurately detect face and scenes in real-time under low light and motion condition. The chip supports dual-SIM dual VoLTE, 2 x 2 Wi-Fi 802.11ac, Bluetooth V5.0 and more as connectivity options.
MediaTek officials claim that this chipset is an AI processing booster with ultra-fast performance and energy consumption. This will bring a new affordable smartphone generation in the market in the future.