MediaTek announced Helio P60 mobile chipset in February earlier this year. The Taiwan-based chipset manufacturer gets an overwhelmed response from the users and it’s performing quite well in terms of longer graphics intensive gameplay, device heating, or any other aspect. The P60 SoC is well-balanced and featured with AI integration which provides longer battery life, better system enhancements similar between Snapdragon 636 and Snapdragon 660 SoC. However, most of the mobile market is dominated by Qualcomm processors, the MediaTek chipsets are also competing very hard. Now the reports suggest that Helio P70 is on the way.
MediaTek Helio P70 Leaked Details
The MediaTek Helio P70 will launch soon as expected, probably before the end of this year. The Helio P70 will be based on the 12nm process which will feature with octa-core Cortex-A73 and Cortex-A53 (4+4) cores coupled with ARM Mali-G72 GPU. It’s quite similar to the latest Helio P60 chipset specifications. However, the difference between Helio P60 and Helio P70 chipset will be very distinct in terms of the dedicated NPU and an advanced AI.
The recently leaked reports mentioned that the Helio P70 SoC will support up to 8GB of RAM, eMMC 5.1 or UFS 2.1 storage, and up to 3 ISPs (supports up to 32MP image sensor and Cat. 12 LTE modem). The advanced AI system will increase the process rate in camera, battery, graphics, and multi-tasking. The processor will definitely compete the Snapdragon 710 SoC in terms of the performance, AI, and stability. That’s really expected because P60 is still so much better in between SDM636 and SDM660 chipsets.
There is no confirmed specifications list revealed yet but it is expected to announce within a few weeks. Till then stay tuned.