Huawei will launch the flagship Kirin 980 SoC on August 31 in Berlin. The company already released invite poster officially in the name of Huawei IFA Keynote. Now the leaks coming out that the processor will be based on 7nm process and the GPU will be Mali-G72 MP24. This 24-core GPU will double the performance regarding the previous generation graphics processor. As per the recent post by Sina Weibo, the HiSilicon Kirin 980 will use the 7nm architecture process including 4×Cortex-A77 cores and 4×Cortex-A55 cores CPU clocked at 2.8GHz.
Huawei Kirin 980 – Specifications and Features
This one would be the World’s first commercial 7nm based mobile chipset by Huawei. According to reports, the Huawei Mate 20 and Mate 20 Pro could be the first flagship device to packed with the Kirin 980 SoC.
The Huawei Mate 20 could come with a 6.3-inch AMOLED display, HiSilicon Kirin 980 SoC, NPU 1M Cambricon or Cambrian 1M, 6GB RAM and 128GB internal storage option. The 8GB+128GB/256GB variant could also be launched. The device could be packed with a 4,200mAh battery with Huawei Super Charge 40W fast charging and wireless charging support and In-Display Fingerprint Sensor.
According to the Cambrian 1M, the energy consumption ratio will be around 5 trillion operation processes per watt, with the help of Artificial Intelligence (AI). The internal process building, graphics rendering, virtual performance, visual and speech task, cloud platform, and machine learning process will be enhanced from the any other NPU (Neural Processing Unit) operation. It can be widely used in smartphones, smartwatches, smart speaker, smart home appliances etc. by Huawei.
The AnTuTu Benchmark score test result of Huawei Mate 20 achieved over 3,50,000 points as per leaks. So, we can expect that the Kirin 980 mobile platform chipset is much powerful than the Kirin 970 SoC. Meantime, Huawei also developed and launched the GPU Turbo technology which increases the graphics performance of low-budget and mid-range smartphones with AI. So, Huawei can build similar like this for their flagship devices which will increase the performance ratio over thermal heating to consume less power.